Geipel, Torsten; Rendler, Li Carlos; Stompe, Manuel; Eitner, Ulrich; Rissing, Lutz
(Amsterdam : Elsevier, 2015)
We compare the thermomechanical stresses in solar cell interconnections based on electrically conductive adhesives (ECA) with soldered joints by using bending experiments and finite element analysis (FEA). Additionally, ...